SIIP China: SEMI Innovation and Investment Forum

Date: Thursday, March 21, 2019
Time: 09:00 – 16:50
Venue: Grand Shanghai Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

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SIIP China, SEMI Innovation Investment Platform, aims to be one of the most collaborative and influential investment platform for global semiconductor industry by leveraging SEMI global industrial resources, together with global industrial capital and intelligence. SIIP China: SEMI Innovation and Investment Forum, is one of SIIP China's brand activities held simultaneously with the annual SEMICON China. Besides the Forum, the SIIP China series include Matchmaking Sessions, Theme Discussions, Regular Industry Investment Gathering and Overseas Delegations.

New applications such as Artificial Intelligence, Cloud Computing, Big Data and IoT are bringing big changes to the semiconductor industry. It is expected that 5G will have even more dramatic effects on our daily lives by its higher speed, bigger capacity and low latency. The global semiconductor industry is entering a major period of transition. Being the biggest integrated circuit consumer market in the world, China has been keeping a two-digit growth these years. The trade friction may have added some uncertainty however we look forward to the promising future from the global perspective. No matter how erratic the external environment is, funds, technology, products and talents have always been the key driving forces for the entire eco-system of semiconductor to grow steadily and healthily.

SIIP China: SEMI Innovation and Investment Forum 2019 will focus on the latest policies, diagnose the current situation of the industry, analyze the capital flows and forecast the future. The New-tech Panel will discuss about how deep learning, big data & cloud computing, 5G and manufacturing will bring dramatic changes to the semiconductor industry and what the perspectives of the China market will be.

In 2018, SEMI completed the integration of Electronic System Design Alliance (ESDA). Consisting of major EDA, IP, and fabless companies, ESDA acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry. The ESDA integration brings key capability and further enhances SEMI's supply-chain coverage and SEMI's vertical application platforms such as Smart Transportation, Smart Manufacturing and Smart Data as well as key enabling technologies including AI, 5G, and Machine Learning. During the ESDA Executive Panel, leading companies such as Alibaba, Mentor, Synopsis, Unisoc and Cadence will talk about their cutting-edge technologies.

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Agenda / 会议日程: (Tentative agenda and yet to be confirmed 详细日程有待确定)
09:00-09:30 Registration 来宾登记
Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人
Lung Chu
President, SEMI China; Vice President, SEMI
Moderator introduces Speakers 主持人介绍出席嘉宾
Liang Sheng
BDA Administrative Commission Director
Keynote Remarks 贵宾致辞
Ding Wenwu
President, China National IC Industry Investment Fund
Chairman, China High-end Integrated Circuits Alliance
  AM Speeches 嘉宾演讲
Wei Shaojun
Director, Institute of Microelectronics, Tsinghua University
Link of OEM and Chip Brings Leap-Forward Development
Shen Weiguo
Chairman of the Board, Shanghai Integrated Circuit Industry Investment Fund
General Manager, Shanghai S&T Investment Co., Ltd.
Semiconductor Outlook: Change is in the Air
Roger Sheng
VP Analyst, Gartner Semiconductors & Electronics research group
Impact of AI on the China Semiconductor and Electronics Ecosystem
Handel Jones
CEO, International Business Strategies, Inc.
韩徳尔•琼斯,International Business Strategies首席执行官
Ye Tianchun
Director, Institute of Microelectronics Chinese Academy of Sciences
11:40-13:30 Lunch break / 午休
  PM Sessions 下午日程
13:30-15:00 Panel Discussion 圆桌论坛
Topic: New Technologies and Perspectives on China Market
  Moderator / 主持人
Charlie Chan
Executive Director, Morgan Stanley
  Panel Discussion嘉宾:
Charlie Chan
Executive Director, Morgan Stanley
Thin-film Processing Technologies for Smart Society
Koukou Suu
Senior Fellow and General Manager of Global Market & Technology Strategy, ULVAC
Allen Lu
President & CEO, Bei Jing E-Town Semiconductor Technology Co., LTD
Leopold Beer
VP Product Management in Automotive Electronics, Bosch
Steve Johnston
Director, Supplier Technology and Industry Development, Global Supply Management, Intel Corporation
15:00-16:40 Electronics System Design Executive Session 电子系统设计高峰论坛
Topic: AI-enabled Smart Application Opportunities and IC Design Solutions
主题: AI驱动的智能应用机遇和IC设计解决方案
Welcome remarks 欢迎致辞
Lung Chu
President, SEMI China; Vice President, SEMI
Opening remarks 论坛致辞
Ajit Manocha
President & CEO, SEMI
Ajit Manocha, SEMI总裁兼首席执行官
  Panel Discussion
Xiaoning Qi
Vice President, Alibaba Group
AI-Enabled Smart Applications: Opportunities, Challenges and Solutions
Xiaoning Qi
Vice President, Alibaba Group
Approach for Domain Specific Designs & Autonomous Vehicles
Danny Perng
PacRim Vice President, Mentor, A Siemens Business
Artificial Intelligence-The Future of Smart Chip Design
David-RJ Lin
Corporate Senior President, AsiaPac Region, Synopsys Inc.
Eric Zhou
Marketing VP, UNISOC
A.I. / Machine Learning: Driving Force for New Generation of EDA Innovation
Qi Wang
VP of Cadence Design Systems Inc. and the CEO of Nanjing Kaiding Electronics Technology Co. Ltd.
AI-enabled Smart Applications
Opportunities and IC Design Solutions

Balachandran Rajendran
Global CTO, Semi / EDA, Unstructured Data Solutions, Dell EMC
16:40-16:45 Lucky Draw 幸运抽奖
16:45-16:50 Thank you 致谢结束