CDC - AI Vision: Dual Engines OLED + Micro LED
| Date: | Wednesday, March 25, 2026 |
| Time: | 09:00-17:20 |
| Venue: | Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
The global display industry sees fierce competition, with AI-display integration driving restructuring. Competition for large-size OLED capacity intensifies: Samsung Display's 8.6G OLED line will mass-produce in Q2 2026; BOE Chengdu 8.6G line accelerates commissioning; TCL CSOT and Visionox advance high-generation lines. Meanwhile, AR giants make efforts: Meta plans LCoS AR devices in 2026 and Micro LED products in 2027; Apple's first Apple Glasses (low-cost AR headset) is expected in 2026.Three core themes:
1. AR+AI Glasses Product Roadmap: Core technology implementation and scenario expansion led by Meta, Apple;
2. Emerging Display Tech Breakthroughs: Large-size OLED mass production, Micro LED cutting-edge applications to solve capacity bottlenecks;
3. Display Innovation Ecosystem & Supply Chain: Seizing global supply chain restructuring opportunities.
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| Agenda / 议程 | |
| 09:00-09:25 | Registration 来宾登记 |
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Moderator 主持人: Gang Dong, Chairman & CEO, Toray Engineering (Shanghai) Co., Ltd. 董刚，董事长兼总经理，东丽先端工程技术（上海）有限公司 |
| Opening 开幕致辞 | |
09:30-09:35
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Lily Feng, President, SEMI China 冯莉，SEMI 中国总裁 |
09:35-09:40
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Xinqing Liang, Chairman, CODA 梁新清，常务副理事长，中国光学光电子行业协会液晶分会 |
09:40-09:45
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Zheng Qi, Senior Vice-president, CSO, BOE Technology Group Co., Ltd. 齐铮，高级副总裁、首席战略官，京东方科技集团股份有限公司 |
| Keynote 主旨报告 | |
09:45-10:05
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Kehan Tian, CTO, Goeroptics 田克汉，首席技术官，歌尔光学科技有限公司 |
10:05-10:25
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Jason Shan, Co-CEO Silicon-based Micro Display Business, General manager, Beijing BOE Optoelectronics Technology Co., Ltd 单庆山，硅基微显示业务Co-CEO，总经理，北京京东方光电科技有限公司 |
10:25-10:45
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Pushing the limits of high-definition technology using inkjet technology Dr.Hidehiro Yoshida, General Manager, Panasonic Production Engineering |
10:45-11:05
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Leping Huang，Chief Technology Analyst, Huatai Securities 黄乐平，全球科技战略首席分析师，华泰金融控股（香港）有限公司 |
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Section 1: AR+AI Glasses Product Roadmap AR+AI眼镜产品规划 |
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11:05-11:25
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Yi Ding, Optics Expert, Shenzhen Thunderbird Network Technology Co., Ltd. 丁毅，光学专家，雷鸟创新技术（深圳）有限公司 |
11:25-11:45
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National Intelligent Sensor Innovation Center Featured 3D Heterogeneous Wafer Reconfiguration Process 国家智能传感器创新中心特色三维异质晶圆重构工艺 Daiqiang Pan，Head of Pilot Line，SICC 潘代强，中试线负责人，国家智能传感器创新中心 |
11:45-12:05
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Bo Zhang，Founder & CEO，SHARGE Technology (Shenzhen) Co., Ltd. 张波，创始人兼首席执行官，闪极科技 |
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Moderator 主持人: River Zhang, Sr. LCOS Operation Director, OmniVision Group 张江元，LCOS高级营运总监，豪威半导体（上海）有限责任公司 |
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Section 2: Innovative Breakthroughs in Emerging Display Technologies 新型显示技术创新突破 |
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14:00-14:20
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梁博，OLED技术企划总监，TCL华星 |
14:20-14:40
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Innovation and Applications of Visionox Intelligent Pixelization (ViP) Technology 维信诺 ViP技术创新应用 党鹏乐，PDT办公室主任，维信诺科技股份有限公司 |
14:40-15:00
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Micro LED display，Make AI Visible to the World Micro LED微显示，让世界“看见”AI Devin Chen，Marketing Director，STARKSEMI SEMICONDUCTOR CO.LTD 陈叠峰，市场总监，星钥半导体（武汉）有限公司 |
15:00-15:20
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Advancements in Display Driver Semiconductor Technology: Shaping the Future of Visual Experience Lawrence Peng, Deputy Director, GlobalFoundries |
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Section 3: Innovation Ecosystem Supply Chain for Display 显示创新生态供应链 |
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15:20-15:40
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Ultra-Low-Power Edge SOC: Driving the Portability and Commercialization of Advanced AR Display Technologies 超低功耗边缘 SOC：驱动 AR 先进显示技术的便携化与商业化 高亢，商务拓展副总裁，恒玄科技（上海）股份有限公司 |
15:40-16:00
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Ultra-Thin and Lightweight Prescription Lenses based on SiC Lightguide Chips 基于SiC光波导芯片的超轻薄近远视镜片 史瑞，CTO&联合创始人，广纳四维（广东）光电科技有限公司 |
16:00-16:20
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High-quality SiC Substrates Power AR Displays 高质量SiC衬底助力AR显示 欧阳鹏根，常务副总经理，浙江晶瑞电子材料有限公司 |
16:20-16:40
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王禹，市场总监，爱发科中国 |
16:40-17:00
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Smart Vision: Trends and Opportunities in the AI Glasses Industry Over the Next Five Years 智见视界：未来五年 AI 眼镜产业趋势与机遇 Xuecheng Chen, Senior Analyst, Mobile Department, Sigmaintell 陈学诚，移动事业部资深分析师，群智咨询 |
17:00-17:20
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Bonding & Debonding Technology Leads a New Era of Advanced Packaging 键合解键合技术引领先进封装新纪元 沈伟，总经理，博纳半导体设备（浙江）有限公司 |
| * Agenda is subject to change 会议议程更新中，以会议现场资料为准。 | |